Monday, May 11, 2020

[MasterDegree] Pasca Sarjana Telkom University Scholarship Program 2020, Indonesia



Telkom University Postgraduate program opens several master programs, namely Masters in Management, Masters in Informatics, Masters in Telecommunications Engineering, and Masters in Industrial Engineering in Bandung, West Java. Through this program, students can further explore science according to their fields and abilities.


Graduate Study Program:

  • Faculty of Economics and Business (FEB):
    • Master of Management Study Program
  • Faculty of Electrical Engineering (FTE):
    • Master of Electrical Engineering - Telecommunications Study Program
  • Faculty of Informatics (FIF):
    • Master of Informatics Study Program
  • Faculty of Industrial Engineering (FRI):
    • Master of Industrial Engineering Study Program
  • Faculty of Creative Industries (FIK):
    • Master of Design Study Program

Fast Track Scholarship Program

The Fast Track Scholarship Program is valid for Telkom University undergraduate students who are currently studying and have completed their 6th semester. By joining the Fast Track Scholarship Program, you can pass the S1 and S2 Programs in just 5 years. This Telkom University S2 scholarship scheme is valid after graduating from S1.
  • 25% scholarship
    • For MM MM Study Programs: GPA S1 3.00 to 3.49
    • For S2 Engineering Study Program: S1 GPA 2.75-3.24
  • 50% scholarship
    • For MM MM Study Programs: GPA S1 ≥ 3,50
    • For Engineering S2 Study Programs: GPA S1 ≥ 3.25 
 
Alumni Scholarship Program"

The alumni scholarship program applies to all Telkom University alumni including STT Telkom / ITT Telkom, STMB Telkom / IM Telkom, STISI Telkom.
  • 25% scholarship
    • For MM MM Study Programs: GPA S1 3.00 to 3.49
    • For S2 Engineering Study Program: S1 GPA 2.75-3.24
    • For S2 Design Study Program: S1 GPA from 3.00 to 3.24
  • 50% scholarship
    • For MM MM Study Programs: GPA S1 ≥ 3,50
    • For Engineering S2 Study Programs: GPA S1 ≥ 3.25
    • For Design Study Programs: GPA S1 ≥ 3.25
  • Blended Learning Scholarship 25%
    • For MM MM Study Programs: GPA S1 ≥ 3,5; TOEFL: ≥ 500 / IELTS 5.5; TPA: 500
    • For Engineering S2 Study Programs: S1 GPA: ≥ 3.25; TOEFL: ≥ 500 / IELTS 5.5; TPA: 500 

Requirement:

  • Attach S1 diploma
  • Attach the transcript of S1 value
  • Has a BAPPENAS TPA certificate with a score of ≥ 450
  • Have a TOEFL ITP / EPRT certificate with a score of ≥ 450
  • Attach a thesis plan proposal
  • Following the interview
Specific Requirement:
  • For Engineering study program applicants: take the Expertise Potential Test (TPK)
  • For S2 Design Management applicants: TPA TOEFL ≥ 400

How to Apply:
  • Create an account at smb.telkomuniversity.ac.id, check email, click activation
  • Fill in the complete biodata, prepare photo softcopy, diploma, transcript, recommendation letter, BAPPENAS TPA score and TOEFL
  • Check the transaction number that will be used to pay the registration fee
  • Buy PIN Rp. 400,000 through BNI / Mandiri
  • PIN code activation on the smb.telkomuniversity.ac.id web
  • Print the participant card and be present according to the selection schedule

Deadline:
10 July 2020

Source:
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